Mechanics

Mechanics

Application Scenario

New‑energy Vehicles: Wire harness terminal crimping, battery‑pack connector crimping, PCB board‑to‑board connector crimping, board‑to‑board crimping, crimping between heat sink and IGBT module, etc. General‑purpose Machinery: Crimping of industrial sensor pins, general‑purpose PCB connector crimping, laminating of industrial components. Consumer Electronics: Housing bonding, battery pressing, battery pole‑piece pressing, PCB laminating, auxiliary‑material bonding, screen & back‑cover pressing.
Application Scenario

Key Process Elements

Closed‑loop Pressure Test: Collect pressing‑force curve in real time, monitor peak pressure, holding pressure and seating force, and judge defective products caused by over‑pressure / under‑pressure. Displacement‑stroke Test: Record ram displacement synchronously, generate force‑displacement curve matched with pressure data, and verify whether pressing depth is qualified. Defect & Abnormality Detection: Identify missing assembly, eccentric load, sticking and abnormal clearance; perform automatic NG sorting and data logging. Synchronous Torque Monitoring: Real‑time torque acquisition of servo motor, assisting diagnosis of assembly sticking and part collision issues.
Key Process Elements

Core Products

ITC-AE643-A1 PCBA  Pin针压合设备

ITC-AE643-A1

PCBA Pin针压合设备

View Details
ITC-AE598-A2 伺服旋铆设备

ITC-AE598-A2

伺服旋铆设备

View Details