Mechanics
Mechanics
Application Scenario
New‑energy Vehicles: Wire harness terminal crimping, battery‑pack connector crimping, PCB board‑to‑board connector crimping, board‑to‑board crimping, crimping between heat sink and IGBT module, etc.
General‑purpose Machinery: Crimping of industrial sensor pins, general‑purpose PCB connector crimping, laminating of industrial components.
Consumer Electronics: Housing bonding, battery pressing, battery pole‑piece pressing, PCB laminating, auxiliary‑material bonding, screen & back‑cover pressing.
Key Process Elements
Closed‑loop Pressure Test: Collect pressing‑force curve in real time, monitor peak pressure, holding pressure and seating force, and judge defective products caused by over‑pressure / under‑pressure.
Displacement‑stroke Test: Record ram displacement synchronously, generate force‑displacement curve matched with pressure data, and verify whether pressing depth is qualified.
Defect & Abnormality Detection: Identify missing assembly, eccentric load, sticking and abnormal clearance; perform automatic NG sorting and data logging.
Synchronous Torque Monitoring: Real‑time torque acquisition of servo motor, assisting diagnosis of assembly sticking and part collision issues.